Test Results
Test results are shown graphically in Figures 2 through
6 and are summarized below.
A. Material Removal Rate The material removal rate with diamond brushes is remarkably higher than the brushes of silicon carbide (C) abrasives for all the materials in test. The material removal rate increases as the diamond particle size in brush fibers increases in the test of all the materials.
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B. Grinding Ratio The diamond brushes show again a remarkably higher grinding ratio than the C abrasives which can give only a remarkably smaller volume of material removal. Grinding ratio of the diamond brushes increases as the particle size increases for all the materials in test.
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C. Workpiece Surface Finish Workpiece surface finish treated with the diamond brushes is rougher than that with the C abrasives brushes. It is due to the significant sharpness of diamond abrasive over C abrasive. The surface finish with C abrasive including #120 is equivalent to that with diamond micron power of #600 in an approximate mesh size.
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D. Tangential Grinding Force Diamond brushes generate a slightly lower tangential grinding force compared with the C abrasive brushes. This shall be one indication of C abrasive dullness.
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E. Workpiece Temperature Increase in Grinding Diamond brushes generate a lower temperature increase in treated materials, compared with the C abrasive brushes. This is related to the shape cutting edges remarkably high thermal conductivity of diamond abrasives.
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