DIA-Stone is an extremely thin cutting wheel developed for grooving or cutting new high-tech materials (materials difficult to cut or groove). Prodluced by binding diamond particles with resin bond, it can be referred to as a resin-bonded diamond cutting wheel.

As compared with electroformed or metal-bonded cutting wheels, DIA-stone is superior in elasticity and cuts materials with a soft touch to fine tolerances. Furthermore, its quality blade is very durable and extremely high in processing efficiency and seldom chips.

TYPE-A
For Super precision cutting

USES

Type-A is especially suitable for dicing materials used for electronic devices such as alumina, glass, silicon, crystal and sapphire.

25.4

40.0

* On demand, we can adjust the dimensions of any cutting wheel of this type (diameter, thickness, hole) as well as the tolerance of its thickness.

TYPE-B
For cutting various kinds of materials

USES

Type-B is suitable for cutting industrial construction materials such as fine ceramics, hard steel, tungsten carbide, firebricks, glass, highly magnetic materials and crystal.

75

10.00

12.70

25.40

31.75

38.10

50.80

* On demand, we can adjust the dimensions of any cutting wheel of this type (diameter, thickness, hole) as well as the tolerance of its thickness.